CDB48500-USB【PDF 10/23 页】KIT USB EVALUATION FOR CDB48500

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5.4 Power Supply Characteristics

Parameter

High-level input voltage

Low-level input voltage, except XTI

Low-level input voltage, XTI

Input hysteresis

High-level output voltage (I O = –2 mA), except XTI

Low-level output voltage (I O = 2 mA), except XTI

Input leakage XTI

Input leakage current (all digital pins with internal pull-up resistors enabled)

Symbol

V IH

V IL

V ILXTI

V hys

V OH

V OL

I LXTI

I LEAK

Min

2.0

—

—

—

VDDIO*0.9

—

—

—

Typ

—

—

—

0.4

—

—

—

—

Max

—

0.8

0.6

—

—

VDDIO*0.1

5

70

Unit

V

V

V

V

V

V

μA

μA

5.4 Power Supply Characteristics

(Measurements performed under operating conditions)

Parameter

Min

Typ

Max

Unit

Operational Power Supply Current:

VDD: Core and I/O operating 1

VDDA: PLL operating

VDDIO: With most ports operating

Total Operational Power Dissipation:

—

—

—

—

203

8

27

480

—

—

—

—

mA

mA

mA

mW

Standby Power Supply Current:

VDD: Core and I/O not clocked

VDDA: PLL halted

VDDIO: All connected I/O pins 3-stated by other ICs in system

Total Standby Power Dissipation

—

—

—

—

100

1

50

348

—

—

—

—

μA

μA

μA

μW

1.Dependent on application firmware and DSP clock speed.

5.5 Thermal Data (48-pin LQFP)

Junction Temperature

Parameter

Symbol

T j

Min

—

Typ

—

Max

125

Unit

°C

Thermal Resistance (Junction to Ambient)

Two-layer board 1

Four-layer board 2

θ ja

—

—

63.5

54

—

—

°C/Watt

Thermal Resistance (Junction to Top of Package)

Two-layer board 3

Four-layer board 4

ψ jt

—

—

0.70

0.64

—

—

°C/Watt

1.Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1 oz. copper covering 20% of the top and bottom layers.

2.Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1 oz. copper covering 20% of the top and bottom layers and 0.5

oz. copper covering 90 % of the internal power plane and ground plane layers.

3.To calculate the die temperature for a given power dissipation

T j = Ambient Temperature + [(Power Dissipation in Watts)* θ ja ]

4.To calculate the case temperature for a given power dissipation

T c = T j – [(Power Dissipation in Watts)* ψ jt ]

10

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